The mica board has a temperature resistance of 500 ℃ under continuous use and 850 ℃ under intermittent use. The product is golden in color, temperature resistance grade: 850 ℃ under continuous use, 1050 ℃ under intermittent use. Excellent high temperature insulation function, temperature resistance up to 1000 ℃.
With the rapid development of science and technology, spacecraft have been updated, and thermal insulation technology as the core technology of spacecraft thermal protection engineering has been listed as a key technology by Europe and the United States and other developed countries. According to the application scope of insulation materials, they can be divided into high temperature insulation materials for spacecraft, normal temperature insulation materials for buildings and other insulation systems, and low temperature insulation materials for refrigeration and other fields.
So far, there are many kinds of high-temperature heat insulation materials developed by various countries, which can be divided into the following three categories according to the different internal organization and structure of materials: fiber heat insulation materials; high-temperature resistant multi-layer heat insulation structure or adding fragment darkening fiber; granular heat insulation materials or fiber and granular composite materials.
Fiber insulation materials have been the first choice of heat insulation materials for spacecraft thermal protection system because of their high temperature resistance, low thermal conductivity, high specific heat capacity and low cost. This kind of material commonly used are aluminosilicate fiber, quartz fiber, alumina fiber, oxide error fiber, etc., can be made into a single fiber mat, fiber cloth, fiber network, fiber paper, etc., or made from several fibers into composite fiber mat, fiber cloth, fiber paper, etc.
The functional indexes of several refractory fibers and products are given. It is obvious from the data that aluminosilicate fiber materials have the advantages of high temperature resistance and low thermal conductivity level.