Introduction to the lamination process of mica sheets

The lamination process of mica board is an important process in lamination molding. The laminating process is based on the requirement of bound thickness, the impregnated adhesive tape is selected into a slab, placed in a polished metal template, placed in a hot press, and heated, pressurized, cured, cooled, demolded, and post-treated.

1、Tape cutting. The process is to cut the tape into a certain plan. Cutting equipment can be connected to fixed-length slicer or manual cutting. When cutting the tape, the scale should be precise, the cut cloth tape is stacked neatly, and the cloth tape with different adhesive content and fluidity is separated and stacked, and records are kept.

2、Tape matching. The tape matching process is very important to the quality of laminated mica board. If it is not matched properly, it will produce defects such as laminate cracking and surface hemp. On the surface of the selected plate, each side should be placed on two face glue content, high fluidity of the tape. The content of volatiles should not be too large. If the volatile content is too large, it should be used after boring treatment.

3、Hot pressing process. The key to constrain the process is the process parameters, of which the important process parameters are temperature, pressure and moment. Overcome the vapor pressure of volatiles, so that the bonded resin flow, so that the tape layer in close contact; cooling to avoid deformation of the plate. The forming pressure is based on the curing properties of the resin. General epoxy / phenolic laminate for 5.9mpa, epoxy plate for 3.9-5.9mpa.

4、Post-treatment. The intention of the post-treatment is to make the resin further curing until curing, while partly reducing the internal stress of the mica board, to improve the bonding function of the product. Epoxy board and epoxy / phenolic board post-processing is maintained at 130-150 ℃ for about 150 minutes.